Electromechanical buckling with application to smart Micro Electro Mechanical Systems

Dr. Samy Abu-Salih

Electromechanical buckling of micro structures, such as thin films and microbeams, that are simultaneously subjected to mechanical and electrical loads

The research focuses on the mechanical response of micro-mechanical elements which are subjected to different types of forces such as mechanical, thermo-mechanical, or electrostatic forces. It is important to note—this being one of the advantages of micro-systems—that electrostatic force is considered one of the most significant forces (physics) that can be integrated into the activation or sensing of a micro-system. This is due to the minimal size of these systems. The combination of mechanical and electrical forces can lead to innovative technological applications, such as the micro-mirrors.

 

 

Electromechanical buckling with application to smart Micro Electro Mechanical Systems

 

 

 

 

 

 

Electromechanical buckling of periodic patterns on stiff film bonded to a compliant substrate – Analytical and numerical postbuckling analyses